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DEBeam shaping, proven in the industry.
Every use case below is a real process our beam shapers make more stable, more repeatable, or simply possible. That runs from semiconductor micro-machining to copper welding, high-power cutting and next-generation AI packaging.
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Semiconductor processing
A homogenized flat-top that stays on-size across a 4–6 mm focus range.
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Precision micro-machining
Flatter floors and cleaner walls than a Gaussian, verified against simulation.
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Engraving on a tilted surface
>3× larger process window and >2× better finish across an 8° tilt.
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Deep 3D ablation in hard metal
7× more stable ablation depth and constant wall angle — no focus tracking.
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Robust high-power laser cutting
Consistent cut quality under thermal drift at 10–50 kW+. Free white paper.
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Copper welding, spatter-free
A single-mirror retrofit brought ring-core seams to an existing welding laser.
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New beam shapes for laser welding
Elliptical flat-top stabilises the copper melt pool — up to 93% less spatter.
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Laser welding of high-performance plastics
Plug & play beam shaping in an Evosys platform — zero rejects on complex geometries.
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Robust, compact laser marking
A combi-function shaper replaces the focusing system — no active focus, no f-Theta.
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Additive manufacturing (LPBF)
Faster build-up with exchangeable beam shaping in the scanner path.
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Measured, not just modelled
Independent high-power characterisation of the 3D Ring-Core with PRIMES.
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Through-Glass Vias for AI packaging
Why 3D beam shaping is the optics-ready foundation for TGV drilling.
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Tell us your laser, material and target. We’ll map it to the right beam profile and scope a first project together.
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