EN
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DEStable processing over a millimetre-scale focus range.
A very small flat-top that stays on-size and uniform across a 4–6 mm focus range, so laser processing of semiconductor materials no longer hinges on a knife-edge focus. Measured with an industry partner.
- Tight focus tolerances: the process sits on a narrow band of Z-positions
- Limited depth of field with conventional shapers
- High process sensitivity to defocus, part height and thermal drift
- Stable flat-top across a 4–6 mm focus range (≈50–75% of the usable depth of focus)
- Wider, more forgiving process window: Z9 through Z12 all pass
- Drop-in with minimal adjustment; robust processing for semiconductor applications
Reduced setup complexity in production
3D Top-Hat
Drop-in with minimal adjustment. A 4–6 mm process window means the same recipe holds across part-height variation and refocus.
Conventional top-hat
Complex tuning required, and only a ~2 mm process window. Every job needs an exact refocus and yield swings with defocus.
What you get
Reduced setup complexity, higher yield and repeatable processing across shifts and machines: a robust basis for volume production.
Comparison from measurements with the industry partner. Values are configuration-specific and confirmed per setup.
Product & further use cases
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