Applications

Where beam shaping changes the process

Each of these fields asks something different of the beam. Start from the one closest to your process.

Controlled energy deposition for stable, high-quality joints.

Sharper features and a wider, more forgiving process window.

Depth-of-focus and taper control for wafer processing and TGV drilling.

Consistent mark quality on curved or height-varying parts — no f-Theta, no active focus.

Tailored intensity profiles for productive, repeatable builds.

Homogenized profiles for precise, gentle energy on sensitive materials.